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| IA NT Features Double contacts Low contact resistance Self-clean on contact area Vapor phase solderable, IR-reflow solderable Terminal plating by gold gives excellent results when soldering RoHS compliant* *R oH S CO The SDM Series is currently available, although not recommended for new designs. M PL SDM Series Surface Mount DIP Switch Electrical Characteristics Electrical Life ............2,000 operations min. per switch, 24 VDC, 25 mA Non-Switching Rating ......100 mA, 50 VDC Switching Rating ................25 mA, 24 VDC Contact Resistance (@ current 100mA) ........................50 milliohms max. at initial 100 milliohms max. after life test Insulation Resistance ........100 megohms min. at 500 15 VDC Dielectric Strength ............500 VDC/minute Capacitance ..................5 pF max. between adjacent closed switch Circuit ....................Single pole single throw Environmental Characteristics Mechanical Life..2,000 operations per switch Operation Force ......................1000 gf max. Stroke ..............................................1.0 mm Operating Temp. Range ....-20 C to +70 C Storage Temperature ........-40 C to +85 C Vibration Test ......................MIL-STD-202F, Method 201A Frequency ..............10-55-10 Hz/1 minute Directions ................X,Y,Z, three mutually perpendicular directions Time......................2 hours each direction. High reliability Shock Test ..........................MIL-STD-202F, Method 213B, Condition A Gravity ..........50 G (peak value), 11 msec Direction & Times....................6 sides and 3 times in each direction. High reliability Physical Characteristics Base and Cover Materials ..UL94V-0 PPS plus glass fiber reinforced Color ................................................Black Actuator Materials ..............................Nylon plus glass fiber reinforced Color ................................................White Contact Materials ....................Alloy copper Terminal Materials ..............................Brass Contact Plating Materials ....3 micro inches gold plating over 40 micro inches nickel Terminal Plating Materials ....................Gold Soldering Process ............Vapor phase and IR-reflow soldering can be applied Standard Packaging ......IC tubes/all poles in the "off" position Product Dimensions SDM Series A + 0.2 / - 0 (A + .008/-0) 2.0 (.079) Packaging Specifications 1.55 0.05 (.061 .002) DIA. 2.00 0.15 (.079 .006) 2.00 0.25 DIA. (.079 .010) 0.50 (.020) 6.20 + 0.2 / -0 (.244 = .008/-0) 4.00 0.1 (.157 .004) 3.0 + 0.10 / -0 (.118 + .004/-0) 1.74 (.069) B 9.80 0.3 (.386 .012) 7.62 0.25 (.300 .010) 0~4 2.54 (.100) TYP. 0.70 (.028) 0.70 MIN. (.028) 1.0 (.039) 16.00 0.1 (.630 .004) POLE 2,3 4,5,6 7,8 9,10,12 TAPE SIZE (W) 16 mm 24 mm 32 mm 44 mm 0.7 0.2 (.028 .088) SDMR SERIES SDMX SERIES How to Order SDM R - 2 - T R Model Actuator * X = Raised Actuator * R = Recessed Actuator 7.40 10.4 (.291) (.409) RECOMMENDED PCB LAYOUT B0.10=2.54X(P-1) (B.004=.10X(P-1)) 1.1 (.043) 2.54 (.100) TYP. Number of Positions * 1 = 1 Position * 2 = 2 Positions * 3 = 3 Positions * 4 = 4 Positions * 5 = 5 Positions * 6 = 6 Positions * 7 = 7 Positions * 8 = 8 Positions * 9 = 9 Positions * 10 = 10 Positions * 12 = 12 Positions SCHEMATIC (TYP.) SCHEMATIC (TYP.) 1,2,3,4,5,6,7,8,9,10,12 POSITIONS AVAILABLE 1,2,3,4,5,6,7,8,9,10 POSITIONS AVAILABLE Seal * X = Standard (Not Sealed) * T = Top Tape Sealed ("R" Actuator only) Packaging Option (Top Sealed, Recessed only) * R = Tape and Reel Packaging (900 pcs./reel) Temperature (C) MODEL NO. SDM-12 SDM-10 SDM-8 SDM-6 SDM-4 SDM-2 POSITIONS 12 10 8 6 4 2 DIM. A DIM. B 31.42 27.94 26.34 22.86 21.26 17.78 16.18 12.70 11.10 7.62 6.02 2.54 Reflow Soldering Profile 275 225 175 125 120 C 75 30-40 Sec. 25 0 20 40 60 10-15 Sec. 80-90 Sec. 35-60 Sec. 240 C 180 C MM DIMENSIONS: (IN) REV. 02/06 *RoHS Directive 2002/95/EC Jan 27 2003 including Annex. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 80 100 120 140 160 180 200 Time (Seconds) |
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